RFID Flip-Clip System
Application:
Both RFID Flip-Chip Systems are using Visual System to locate the chip and the antenna; make the throughput with almost 99.5% yield. Both models handle all processes in one system platform: antenna web handling, epoxy jetting, flip chip, final curing, and testing; suitable for all types of HF / UHF RFID Inlay.
Features:
- The flip chip machine is designed with PLC program control.
- Big LED display.
- Transferring card by servo system and parameter and mode settlement to make the machine in faster speed and higher accuracy.
- Thickness detection can avoid double sheets.
- It is applied for two or three sheets positioning welding, but the thickness is required for more than 0.12mm material.
- Servo-driver belt transfers the card to make the speed adjustable.
- Accurate positioning and the three sheets in different dimension will not affect the positioning.
- Object gravity makes positioning more accurate.
Double detection sensor.
Feeding card steady without scratch and damage.
Technical Parameters:
| Model | DZJ-4000 | DZJ-8000 |
|---|---|---|
| Bonding Speed | 3500 UPH | 5500 UPH |
| Bonding Accuracy | ± 50 μm | ± 50 μm |
| Wafer Picking | (wafer) 6, 8, 12 | (wafer) 6, 8, 12 |
| Chip Specification | 0.4～2.0 mm | 0.4～2.0 mm |
| Compressed Air | 0.45～0.6 mpa | 0.45～0.6 mpa |
| Vacuum Pressure | -80～-100 kpa | -80～-100 kpa |
| Material Bandwidth | 80 — 370 mm | 80 — 370 mm |
| Bound Point Spacing | ≥ 20 mm | ≥ 20 mm |
| Power Supply | AC 220V 50Hz | AC 220V 50Hz |
| Power Consumption | 7 kw | 7 kw |
| Dimensions | 5800 × 1500 × 1600 mm | 6600 × 1500 × 1600 mm |
