RFID Flip-Clip System

Application:

Both RFID Flip-Chip Systems are using Visual System to locate the chip and the antenna; make the throughput with almost 99.5% yield. Both models handle all processes in one system platform: antenna web handling, epoxy jetting, flip chip, final curing, and testing; suitable for all types of HF / UHF RFID Inlay.

Features:

The flip chip machine is designed with PLC program control.
Big LED display.
Transferring card by servo system and parameter and mode settlement to make the machine in faster speed and higher accuracy.
Thickness detection can avoid double sheets.
It is applied for two or three sheets positioning welding, but the thickness is required for more than 0.12mm material.
Servo-driver belt transfers the card to make the speed adjustable.
Accurate positioning and the three sheets in different dimension will not affect the positioning.
Object gravity makes positioning more accurate.
Double detection sensor.
Feeding card steady without scratch and damage.

Technical Parameters:

Model	DZJ-4000	DZJ-8000
Bonding Speed	3500 UPH	5500 UPH
Bonding Accuracy	± 50 μm	± 50 μm
Wafer Picking	(wafer) 6, 8, 12	(wafer) 6, 8, 12
Chip Specification	0.4～2.0 mm	0.4～2.0 mm
Compressed Air	0.45～0.6 mpa	0.45～0.6 mpa
Vacuum Pressure	-80～-100 kpa	-80～-100 kpa
Material Bandwidth	80 — 370 mm	80 — 370 mm
Bound Point Spacing	≥ 20 mm	≥ 20 mm
Power Supply	AC 220V 50Hz	AC 220V 50Hz
Power Consumption	7 kw	7 kw
Dimensions	5800 × 1500 × 1600 mm	6600 × 1500 × 1600 mm